SEOUL, South Korea / RankWire.AI / – Samsung Electronics has introduced innovative memory and storage solutions aimed at enhancing artificial intelligence system performance. The company announced these initiatives at the 2026 OCP Global Summit in San Jose, California, which took place from October 12 to 15. The roadmap emphasizes high-performance memory, expanding memory through Compute Express Link, and next-generation SSDs. Additionally, Samsung will collaborate with AMD on a joint CXL demonstration. These strategies aim to address current AI server capacity limitations.
Samsung outlined its approach through three core objectives: increasing speed, improving memory scalability, and ensuring data persistence. To boost speed, the company showcased customized high-bandwidth memory along with HBM5, the eighth generation of the technology. For scalability, CXL was promoted as a means to extend capacity beyond the onboard memory of each server. Regarding data persistence, Samsung presented next-generation SSD-based storage and management solutions, along with software designed to optimize data processing efficiency in AI systems.
As AI agents become more prevalent, the demand for increased memory during inference is rising, according to Samsung. Larger AI models generate more data during response creation, which must remain accessible to processors. Traditional systems restrict the amount of memory accessible per processor. Samsung’s presentation of CXL technology highlights a practical solution to this challenge. The company also demonstrated key-value cache optimization, enabling AI models to reuse processed data instead of duplicating efforts.
Partnership with AMD Expands to CXL Memory Expansion Solutions
Samsung and AMD will jointly showcase a CXL-based system designed to increase memory capacity in AI infrastructure. This technology allows processors to share memory resources rather than relying solely on local server memory. Samsung reports that engineers have validated this solution in real-world environments. The demonstration builds upon a memorandum of understanding signed in March 2026 between the two companies, focusing on next-generation AI memory and computing. AMD CEO Lisa Su visited Korea on October 7 and met Jeon Young-hyun, Vice Chairman of Samsung’s Device Solutions division.
Memory pooling was another highlight of Samsung’s presentation. The company introduced CMM-D, a CXL-enabled DRAM module that connects multiple memory units into a shared pool. This allows systems to draw additional capacity as workload demands increase. Samsung also showcased processing-in-memory technology, which performs some calculations within memory chips to reduce data movement and energy consumption. Exhibits included 2-nanometer gate-all-around wafers, Groq LPU wafers, and Nvidia’s Groq 3 LPX system.
Early Co-Design Efforts Shape Samsung’s AI Memory Strategy
Samsung’s Corporate Vice President and Head of the Application Engineering Team, Shim Ho-jun, detailed the company’s plans during an executive session. He emphasized that the increasing size of AI models and higher inference demands necessitate greater memory capacity and bandwidth to maintain system performance. Shim also highlighted Samsung’s efforts to expand co-design and technical validation with global partners from the earliest development stages, aiming to better align memory and storage products with customer system designs.
Samsung MAX Lab provides a testing environment for customers to evaluate memory and storage solutions under real-world AI workloads. The lab also offers co-design services tailored to specific system configurations, enabling early testing of pre-commercial technologies such as PIM and next-generation SSDs before market release. Samsung participated in the summit as a Diamond Sponsor. This event follows its 2026 appearances at Nvidia GTC, COMPUTEX, and the Future of Memory and Storage conference, as the company continues to expand its presence in AI memory innovation.